• Nanometer Microporous Heat Insulation Plate for Ladle
  • Nanometer Microporous Heat Insulation Plate for Ladle
  • Nanometer Microporous Heat Insulation Plate for Ladle
  • Nanometer Microporous Heat Insulation Plate for Ladle
  • Nanometer Microporous Heat Insulation Plate for Ladle

Nanometer Microporous Heat Insulation Plate for Ladle

Refractoriness (℃): 1580< Refractoriness< 1770
Feature: Long Time Materials
Type: Refractory Material
Shape: Block
Material: Silicon Carbide (SiC)
Transport Package: Pallet
Samples:
US$ 1/Piece 1 Piece(Min.Order)
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Basic Info.

Model NO.
WHMF-42B
Specification
1000*600*10-50
Trademark
WH
Origin
Shanghai
HS Code
6811820000
Production Capacity
100000m2

Product Description

Introduction
 
 Nano Microporous Insulation Bare Board is based on the principle of microporous ,made by various materials through special processing.Its thermal conductivity rate is lower than the stillness air ,and almost ceramic fiber insulation materials'1/4 to 1/10,which is the most lowest conductivity rate among the other solid materials .Also have addressed worldwide insulation problems ,it is a unique and the best choice in some high temperature equipment that strictly need space and weight and have already motivated the innovation of other relevant insulation equipment design .
Characteristics
Low thermal conductivity and heat loss
Low thermal storage,good thermal stability
High safety of environment protection
Easy to cut and process
Long working time

Typical Applications
Steel(Tundish, ladle, torpedo ladle )
  • Petrochemical (cracking furnace ,hydrogen furnace,conversion furnace ,heating furnace )
  • Glass(float pool kiln,toughened furnace,hot bending furnace)
  • Heat-treatment furnace
  • Pipe insulation
  • Ceramics
  • Electrics
  • Household electrical appliances
  • Aerospace
  • Ocean shipping
  • Mine-used lifesaving cabin
     
    Physical&Chemical technical data
                            Type   1100ºC Microporous insulation board
Density (kg/m3) 280-350
Rupture strength(MPA) 0.7
Permanent linear shrinkage%(800ºC×6H) <2.5%
Thermal conductivity rate (W/m.K) 0.025(at 200 ºC)
0.028(at 400 ºC)
0.032(at 600 ºC)
0.037(at 800 ºC)
 
 
Standard Dimension  
   
600 ×300×5-20mm
   Special size can be produced according to customer's requests .



 
 
 

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